Sell Tab/fob Bonding M/c

Application:
The machine is used for bonding FPC, COF, TAB onto various LCD panels and PCB.

Basic Parameter
Voltage:AC220V 50-60HZ
Operation Mode:7" interface
Rating Power:1.5kw(constant heat) 4kw (pulseheat)
LCD Table:Servo memory and auto location
Pressure:0.4-0.8Mpa
TAB Fixture:Micrometer adjust X-Y-θ
Bond Head :60mm(constant heat) 50mm(pulse heat)
Thermocouple:K type
Rolliing Mode:Auto
Program Control:PLC and servo controller
Vision system:Two C/C CCD
Heat Mode:Constant heat and pulse heat
Weight:320kg
Dimension: (L)2210x (W)1730 x (H)1455mm