 | Zhenxun Technology Co., Ltd | Preview | Staging |
| Description: | ZX-C1 BGA Repaire machine Features: 1.With three independent temperature zone control, upper and bottom main heater with hot air to heat, third zone with infrared to preheat; 2.Upper heater with 8 segment temperature up (down)+8 segment constant temperature control, can store 10 groups temperature curve; Upper, bottom heater and infrared start heating at the same time; 3.Three temperature zone with independent PID to control heating process, more stable and accurate; 4.Bottom heater and IR preheating zone with supporter to prevent PCB part deformation; 5. After remove and solder, using high-volume fan to cool the PCB board, prevent deformation of PCB board and ensure the effect of soldering; 6.Equipped with a variety size of hot-air nozzle, or made according to special requirements, free rotation of hot air nozzles; 7.Build-in vacuum pump, no need gas source. Specifications PCB size ≤L540 *W450mm PCB Thickness 0.1~5mm Temperature Control K Thermocouple, Closed loop PCB Positioning Outer Sub (Bottom) heater Infrared 2400W Main (Top) heater Hot air 800W+800W Power supply Single phase 220V,50/60Hz,3.4KVA Machine dimension L700 ×W475×H520mm Weight of machine Approx.33kgs |
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| Place of Origin: | China |
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| Brand: | Zhenxun Technology Co., Ltd |
| Payment Terms: | T/T;Cash |
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