| Description | No. of Layers | Min. Line Space | Min. Line Width (mm) | Min. Hole Diameter (mm) | Max. Board Size | Thickness | Technology Type | Base Laminate Materials | Board Technology | Solder Mask | Surface Plating | Coating | Turn Around Time for Prototype | Turn Around Time for Bulk (Days) | CAD Software (PCB Approval) | Quality Standard | Manufacturing Facilities | Production Capacity (Square Meters/day) | PDF/DWF Filename |
| TP-11 | 3 | 0.1 mm | 0.1 | 0.25 | 500 mm x 600 mm (LxW) | 3 mm | Gold Plated | FR4 | Surface mount | Liquid Photo Imagable | Gold | Hot air leveling , Entek |