Dip Switch

MECHANICAL
1.Operation Force: 800g Max
2.Stroke: 0.70mm
3.Operation temp: -20degree~70degree
4.Storage Temp: -40degree to 85degree

MATERIALS
1.BASE: Engineering plastics,Black.
2.COVER: Engineering plastics,Black.
3.BUTTON: Engineering plastics,White.
4.TERMINAL: Alloy copper,Gold plating.

ELECTRICAL
1.Electrical Life: 2000 operations cycles per switch.
2.Non-Switching Rating: 100mA,50VDC
3.Switching Rating: 25mA,24VDC
4.Contact Resistance: 50m Max,at initial;100m Max,after life test.
5.Insulation Resistance: 100m,500VDC
6.Dielectric Serength: 500VCD/1 minute
7.Capacitance: 5pF Max.
8.Circuit:Single pole single throw.

SOLDERING AND CLEANING PROCESSES
1.Keep all switch contacts in their "OFF" position for all operation .
2.Wave Soldering: Recommended Solder Temperature at 260degree Max.5 seconds for IC type.
3.Hand Soldering: Use a soldering iron of 30 watts, controlled at 320degree approximately 2 seconds,while applying solder.
4.Reflow Soldering: Reflow zone 240degree for 20 seconds.(for SMT type,see the picture)
5.Cleaning Process: Flux clean using force rinse,high agitation or triple bath cleaning mathod.
Freon TF or TE give excellent results.When vapor methods are used do not subject the switch to solvents at temperature above 51degree.