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Abp (shenzhen) Electronics Co,.ltd

2 Layers Pcb With 0.50.5oz Minimum Copper Thickness And Green Solder Mask

2 Layers Pcb With 0.50.5oz Minimum Copper Thickness And Green Solder Mask

2 Layers Pcb With 0.50.5oz Minimum Copper Thickness And Green Solder Mask 2 Layers Pcb With 0.50.5oz Minimum Copper Thickness And Green Solder Mask
OUR CAPACITY:

Layers and Type:1-30 layers standard PCB, Blind Vias and Buried Vias Board.
Minimum Track Space:4mil /4 mil,3mils partial allowed;
Minimum Annular Ring:3 mils for via hole 6mils for component hole.
Board Thicknes:0.2mm-6.0mm
Technique: HAL, HASL (lead free), immersion gold, Immersion Tin, Plated Tin, Immersion Silver, OSP, Flux, flash gold
Copper thickness:0.5/0.5OZ-6/6OZ
Materials: Fr4, rogers, Teflon, high temperature, free halogen, aluminum-based, ISOLA.
Monthly Output:10,000 to 19,999 Square Meter

Company Profile

  • Business Type:
  • Manufacturer
  • Country:
  • China
  • Employee Count:
  • 500
  • Established Year:
  • 2004
  • Yearly Sales Volume:
  • Less than US$1M

Contact Information

  • Company Name:
  • Abp (shenzhen) Electronics Co,.ltd
  • Country:
  • China
  • Address:
  • 6/f, 4th Block, Zhuguang Chuangxin Technology Park, Zhuguang Rd, Xili, Nanshan District, Shenzhen City, Guangdong Province, China.
  • Website:
  • http://www.abp.net.cn

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