Magnetron Sputtering Target

Offer as the following:
Magnetron sputtering target
（CNM could provide high quality target material for the field of electrical and semiconductor devices，flat panel display , architectural and automotive glass, thin film solar cell, magnetic storage, instrument, decorate thin film, etc.）
High purity metal sputtering target material (3N-6N):
Aluminum, chromium, copper, nickel, silicon, germanium, niobium target, titanium target, indium, silver, tin, graphite, tantalum, molybdenum, gold, hafnium, manganese, zirconium, magnesium, zinc, lead, iridium, yttrium, cerium, lanthanum, ytterbium, gadolinium, platinum, etc..
High density ceramic target (3N-5N):
ITO target, AZO target, IGZO target, magnesium oxide target, yttrium oxide target, iron oxide target, nickel oxide, chromium oxide, zinc oxide, zinc sulfide, cadmium sulfide, molybdenum disulfide, silicon dioxide, silicon monoxide, zirconium dioxide, niobium pentoxide, titanium dioxide, hafnium oxide, titanium boride, zirconium diboride, tungstic oxide, aluminum oxide, tantalum pentoxide, magnesium fluoride, zinc selenide, aluminum nitride target, silicon nitride target, boron nitride, titanium nitride, silicon carbide, lithium niobate, praseodymium titanate, barium titanate, lanthanum titanate, and so on..
Note: The ceramic target produced in CNM adopts the most advanced ceramic production technology—inert gas protection hot isostatic pressing sintering technology, the relative density is grater than 95-99%. In addition, CNM could provide with the metalizing process of the target and unbounded services.