Flex Circuit Board

Line width : 0.08mm
Line space: 0.08mm
Hole:0.20mm
Thickness:0.15-0.35mm
Layer:1-8 layers
Coverlay: Polyimide or Soldermask
Finished：ENIG/Immersion Tin


FPC Technology:

Line width : 0.08mm
Line space: 0.08mm
Hole:0.20mm
Thickness:0.15-0.35mm

Layer:1-8 layers

Base Material:

FCCL:
Polymimide ( PI ) and PET
Copper type: ED Copper & RA Copper
Copper thickness: 12-70um
Polyimide thickness:12-50um
Adhesive thickness:12-25

Coverlay:
Coverlay thickness: 12-50um
Adhesive thickness: 12-25um

Stiffener:
Stiffener thickness: 0.10-0.20mm for PI,
0.1-1.6 mm for FR4
0.1-0.5mm for steel
Adhesive:
Adhesive thickness:15-25um

Profile: Laser cuting and Tooling punching