| Abp (shenzhen) Electronics Co,.ltd | Preview | Staging |
| Description: | OUR CAPACITY: Layers and Type:1-30 layers standard PCB, Blind Vias and Buried Vias Board. Minimum Track Space:4mil /4 mil,3mils partial allowed; Minimum Annular Ring:3 mils for via hole 6mils for component hole. Board Thicknes:0.2mm-6.0mm Technique: HAL, HASL (lead free), immersion gold, Immersion Tin, Plated Tin, Immersion Silver, OSP, Flux, flash gold Copper thickness:0.5/0.5OZ-6/6OZ Materials: Fr4, rogers, Teflon, high temperature, free halogen, aluminum-based, ISOLA. Monthly Output:10,000 to 19,999 Square Meter |
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| Place of Origin: | China |
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| Brand: | Abp |
| Payment Terms: | T/T |
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