| Gusheng Technology Co., Ltd | Preview | Staging |
| Description: | Layer: 1Layer~Multilayer Min Trace&Space: 4mil/4mil Material: FR-4, High Tg FR4, Aluminium Based Material, Isola、Taconic、Arlon、Nelco、Rogers Etc Thickness: 0.2mm~6.0mm Cu(In/Ex): 1 oz~12 oz Finish: OSP, HASL, Gold Plating, Immersion Gold Au,Ni Thickness Control: (1)ENIG: 1-10uin; (2)Gold Finger: 1-120uin;(3) Plating Gold 1-3uin; (4)Hard Gold: 1-150uin; (5) Ni thickness: 50-500uin etc Min Hole: 0.1mm vacuum packaging |
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| Payment Terms: | T/T;Cash |
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